Tin Solder Bar Lead Free Solder Bar/Rog Sn0.7CuNi
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Price:
Negotiable
- minimum:
- Total supply:
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Delivery term:
The date of payment from buyers deliver within days
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seat:
Jiangsu
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Validity to:
Long-term effective
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Last update:
2017-11-09 16:47
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Browse the number:
253
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Suzhou Lihng Electronic Technology Co., Ltd.
- Contactaixin:
Mr. Bill(Mr.)
- Email: telephone:
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Arrea:
Jiangsu
Address:No. 365 Tongda Road, Wuzhong Development Zone, Suzhou, Jiangsu, China 215124
- Website:
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1. Application
The product is lead free solder bar, used in electronics parts and Electrical appliance.
2.The chemical composition
2.1 Main ingredient
Main ingredient(wt%) | ||
Cu | Ni | Sn |
0.7(±0.1) | 0.05(±0.01) | Balance |
Impurity of solder alloy(wt%) Max | |||||||||
Pb | Sb | Bi | P | Fe | Al | Zn | As | In | Cd |
0.03 | 0.05 | 0.1 | 0.003 | 0.02 | 0.001 | 0.001 | 0.03 | 0.05 | 0.002 |
3. Form, Diameter ,Weight and Tolerance
Form | Dimension and Tolerance(mm) | Weight | |
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Length 323.0 | ±5.0 |
715g/Pc (±5g) |
Width 20.0 | ±2.5 | ||
Height 15.0 | ±1.5 |
4.Physical Property of solder alloy(Reference Value)
Melting Point | Specific Gravity | Tensile Strength | Elongation | Working Point |
227 ºC | 7.4±0.2 | 34Mpa | 38% | 260-290ºC |
5.Unit mass and Packaging
Packaging | |||||
Type | N.W/CTN | G.W/CTN | |||
corrugated box |
20KG±100g | 20.3KG±100g |
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